Description
… FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total capacity is 16GB. Each module has been tested to run at DDR4-2933 at a low latency timing of 15-17-17 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.FeaturesPower Supply: VDD=1.2V TypicalVDDQ = 1.2V TypicalVPP – 2.5V TypicalVDDSPD = 2.4V to 3.3VOn-Die termination (ODT)16 internal banks; 4 groups of 4 banks eachBi-directional Differential Data Strobe8-bit pre-fetchBurst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)HyperX Infrared Sync working distance 18mmFactory preset RGB wave lighting effectHeight 1.661 inches (42.20mm)Extra InfoMemory Size: 16384MBModule Size: 8192MBMemory Type: DDR4Memory Package: DIMMPin Configuration: 288 pinsMain Colour: Black
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