Description
… FBGA components per module. Each module kit supports Intel Extreme
Memory Profiles (Intel XMP) 2.0. Total capacity is 32GB. Each module has
been tested to run at DDR4-3200 at a low latency timing of 16-18-18 at
1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400
timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
Features
Power Supply: VDD=1.2V Typical
VDDQ = 1.2V Typical
VPP – 2.5V Typical
VDDSPD = 2.4V to 3.3V
On-Die termination (ODT)
16 internal banks; 4 groups of 4 banks each
Bi-directional Differential Data Strobe
8-bit pre-fetch
Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
HyperX Infrared Sync working distance 18mm
Factory preset RGB wave lighting effect
Height 1.661 inches (42.20mm)
Specification:
– CPU Compatibility: Intel Skylake / Kabylake / Coffeelake ( LGA 1151 )
& Ryzen (AM4)
– Chipset: Intel Chipsets & AMD Chipsets
– Capacity: 32GB (8GBx4)
– Quad Channel kit: Yes
– Tested Speed: DDR4-3200 MHz (PC4-25600)
– Tested Latency: 16-16-16-36
– Tested Voltage: 1.35V
– Registered/Unbuffered: Unbuffered
– Error Checking: Non-ECC
– Type: 288-pin UDIMM
– SPD Speed: 2133 MHz
– SPD Voltage: 1.2V
– Warranty: Lifetime
Extra Info
Memory Size: 32768MB
Module Size: 8192MB
Memory Type: DDR4
Memory Package: DIMM
Pin Configuration: 288 pins
Main Colour: Black
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